Bolstered by consumer preference and inherent cost savings.
January 27, 2017
As sustainability issues move to the forefront of the national conversation, we reached out to Tom Egan, vice president, Industry Services, PMMI, The Association for Packaging and Processing Technologies, to find out what the future might hold for sustainability initiatives in the consumer packaged goods industry, what considerations brands must heed and what resources are available to brands looking to make a difference.
Beckhoff Automation will showcase system-integrated solutions for IoT and Industrie 4.0, with advanced IoT hardware, combining to demonstrate practical implementation of cloud-connected Smart Factory concepts.
The highlight of this year’s exhibit will be demonstrations of Cognex’s DS1000 series of 3D displacement sensors, which address 3D applications that demand high resolution and expanded measurement range, such as measuring height, volume and tilt of parts.
Expecting more than 50,000 processing and packaging professionals, over 2,300 exhibitors, 100-plus educational sessions and serving over 40 vertical markets, PACK EXPO International is the place to be.