Bosch to display integrated system solution for liquid, viscous food at PACK EXPO 2016
Bosch Packaging Technology (boschpackaging.com) will debut its integrated system solution for liquid, viscous and pumpable foods at this year's PACK EXPO International in Chicago. The result of the close cooperation between the latest member of the Bosch family in North America – Osgood, the manufacturer of fill and seal machinery for pre-formed containers, and Kliklok-Woodman, the supplier of vertical form, fill and seal (VFFS) machines and secondary packaging equipment – is a complete system solution to address the growing market demand for containers in wrap-around cartons. At the show, Bosch will run live demonstrations of a solution, packing two yogurt cups in a cost-efficient wrap-around carton.
“One of the key benefits of being a part of the Bosch Group, is the ability to mix and match primary and secondary packaging offerings to create truly unique solutions, which answer specific market and consumer needs,” says Janet Darnley, director of marketing and product manager secondary packaging at Bosch Packaging Technology (Kliklok-Woodman). “The liquid food system we are presenting at PACK EXPO International this year is testimony to such cooperation, offering our customers’ trouble-free integration straight into their existing production setups.”