Beckhoff IoT Pavilion at Pack Expo 2016 to showcase Smart Factory solutions
Beckhoff Automation (beckhoffautomation.com) will showcase system-integrated solutions for IoT and Industrie 4.0 this year at Pack Expo International. In Booth #N-6125, advanced IoT hardware and software technologies from Beckhoff will combine to demonstrate practical implementation of cloud-connected Smart Factory concepts.
Pack Expo will take place from November 6 – 9, 2016 in Chicago’s McCormick Place. Visitors to the Beckhoff booth will have the opportunity to use their own smartphones to interact with PC-based control demos – including the ability to connect with an entire wall of IoT-enabled devices and a 6-axis robot arm using any mobile device with a web browser. For an added level of interactivity, Beckhoff will also show an advanced augmented reality and wearable HMI proof of concept in the form of Microsoft HoloLens™ connected to Beckhoff IoT demos. Visitors to Beckhoff booth N-6125 will have the chance to experience this firsthand and see that, with PC-based control technology, it is already possible to leverage the latest wearable and mobile technologies as another interface to plant floor machinery.