Packaging Strategies resented Global Pouch Forum

Toppan Chris WardChris Ward
Vice President of Technology
InterFlex Group, part of the Global Packaging Division of TOPPAN, Inc

Chris Ward, Ph.D., serves as the Vice President of Technology of the InterFlex Group, part of the Global Packaging Division of Toppan Inc., and is a member of the Toppan Innovation Center. Located at InterFlex’s Technology Center in Appleton, Wisconsin, Chris has 30 years of experience in Flexible Packaging R&D with a strong track record of collaborative innovation and implementation of sustainable solutions and productivity improvements across a range of converting technologies and packaging applications. Fluent in French and a former expat, Chris brings a global perspective to his work underpinned by his passion for basketball, hiking, cooking, and travel.