Accordingly, DFR used in semiconductor packaging must also meet increasingly stringent standards for both quality and supply reliability. “In this context, Taiwan is a strategically important location with a strong concentration of semiconductor packaging-related companies, making it essential to have a supply system capable of supplying products rapidly and reliably in close proximity to customers,” the company notes. 

Slitting is the process by which master rolls of film are cut into narrower widths in accordance with individual customer requirements. It is a critical process that directly impacts both product quality and supply reliability. 

To respond to growing market demand for DFR, Asahi Kasei’s new slitting facility is equipped with state-of-the-art machines and some of the most rigorous cleanroom standards for improved productivity and dependable supply. The facility represents an investment of approximately ¥2 billion (approximately $12 million or €11 million) and will expand capacity by 40% with the potential to double current output. 

SUNFORT™ DFR delivers ultra-high resolution with conventional stepper exposure systems and laser direct imaging (LDI) systems, which transfer circuit patterns onto substrates for packaging. “This approach improves performance and precision in semiconductor manufacturing back-end processes,” Asahi Kasei notes. 

About Asahi Kasei  

Asahi Kasei is a diversified global company. Since its foundation in 1922, with businesses in ammonia and cellulose fiber, Asahi Kasei has consistently grown through proactive portfolio transformation. With 50,000 employees worldwide, the company contributes to sustainability by providing solutions to the world’s challenges across its three business sectors: Healthcare, Homes, and Material. For more information, visit https://www.asahi-kasei.com/.