The Indonesian market for blown-film packaging is booming, officials say. The challenges to be tackled and the economic conditions to be fulfilled to satisfy the high demands were discussed at the second Extrusioneers Summit held by Reifenhäuser in Jakarta on Sept. 2, 2014.
The Goss Packaging Technology Center in Durham, N.H., which launched back in April of this year, has played host to its first open demo week after many weeks of individual closed testing and demonstrations.
DuPont has appointed James C. Collins Jr., and Matthew L. Trerotola, both currently senior vice presidents, to executive vice president and members of the company’s office of the chief executive, effective Dec. 1.
Neil Kozarsky, CEO and president of Technical Help in Engineering and Marketing, will deliver a presentation on Snapsil, a new, easy-open thermoformed packaging technology on Tuesday, Nov. 4, 11:30 am at Pack Expo 2014 in Chicago at the Bemis Co. exhibit.
Parkinson Technologies Inc. has announced the latest addition to its onsite technology laboratories: an infrared transverse direction orientation system.