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Robust Education Comes to PACK EXPO Las Vegas Floor

Professional development complements what you’ll find on the show floor at PACK EXPO’s largest Las Vegas show to date

September 6, 2013
To address today’s vital manufacturing trends and challenges, PACK EXPO Las Vegas (Sept. 23–25, 2013; Las Vegas Convention Center) will bring industry expertise to the show floor with free, convenient educational programming. Sessions presented by suppliers and other industry experts will take place throughout the show floor, with locations that include the Innovation Stage (Booths C-141, C-142 and C-143), the Center for Trends & Technology, sponsored by Rockwell Automation and its Partner Network™ (Booth C-1358) and the Food Safety Summit Resource Center, sponsored by GE Intelligent Platforms and BNP Media (Booth S- 7332).
 
“Bringing education to the show floor is part of PMMI’s customer-centric approach. Attendees have asked for great opportunities to learn about trends and technologies — but they don’t want to lose time on the floor,” says Charles D. Yuska, president and CEO of PMMI, The Association for Packaging and Processing Technologies, which owns and produces PACK EXPO Las Vegas.
 
More than 26,000 packaging and processing professionals are expected to attend PACK EXPO Las Vegas 2013, featuring solutions from nearly 1,750 exhibitors spanning 700,000 net square feet. The size and scope of the upcoming event makes it the largest PACK EXPO Las Vegas ever — and the most comprehensive packaging and processing trade show in the world this year.
 
To register for PACK EXPO Las Vegas 2013 and to see full details on sessions presented at Innovation Stage, the Center for Trends & Technology, and the Food Safety Summit Resource Center, visit Packexpo.com. Discounted registration rates of $30 per person apply until September 9, 2013; costs increase to $60 per person after that date and on-site.
 
 
PMMI
(703) 243-8555
www.pmmi.org

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