Established in 2005, the FPA Flexible Packaging Academic Scholarship & Internship Program provides career development opportunities for students in packaging and related disciplines
FPA Resource Recovery Consultant Peter Hunderup and Ram Singhal, FPA Vice President of Environment and Technology provided an update to the Material Optimization Committee of PAC NEXT.
Be sure to visit FPA (booth N-4533) during PACK EXPO International, November 2-5, 2014 in the Association Pavilion located in the North Hall/Grand Concourse Lobby of McCormick Place in Chicago, IL.
Meeting consumer demand for portable, resealable packaging, Clear Lam Packaging Inc. has worked closely with Stonyfield to develop special packaging films for a new yogurt pouch that answers the demands of today’s consumers
Anderson & Vreeland Inc., manufacturer and distributor of flexographic plate processing equipment and materials, has appointed Kevin Schilling to serve as technologies specialist.