The global smart packaging market is expected to grow at 5.4% CAGR, hitting about US$52B by 2025. Market drivers include growing market for sustainable printed electronics, the Internet of Things and cloud computing, and rising food safety concerns.
Products are being shipped all over the world. There is no place on the planet where any manufactured product cannot be shipped, but you need to ensure that the product reaches its destination in excellent condition.
Beckhoff Automation will showcase system-integrated solutions for IoT and Industrie 4.0, with advanced IoT hardware, combining to demonstrate practical implementation of cloud-connected Smart Factory concepts.