INDEVCO to Unveil New Sustainable Packaging Materials at PACK EXPO Las Vegas
INDEVCO Packaging Solutions, a global leader in innovative packaging solutions, has announced its participation in PACK EXPO 2023 at the Las Vegas Convention Center from September 11-13, 2023. The INDEVCO Packaging Solutions division will unveil its latest advancements in sustainable packaging materials, featuring lightweight, downgauged paperboard and plastic options made from renewable or recycled raw materials at Booth #N9254.
PACK EXPO brings together solutions for packaging and processing, highlighting the increasing requirement to deliver solutions that optimize material usage, minimize waste, and reduce environmental footprint. By using interactive touchscreens, visitors at the booth can compare the product’s Life Cycle Analyses (LCA). The variables include fossil fuel use, greenhouse warming potential, and water consumption by comparing competing materials, recycled content options, and coatings.