Emerson to Exhibit Floor to Cloud Packaging Solutions at PACK EXPO Las Vegas
Global technology, software and engineering leader Emerson will exhibit its Floor to CloudTM packaging solutions at PACK EXPO Las Vegas, September 11-13, 2023. As the future of automation, Floor to Cloud solutions empower smarter packaging lines and more efficient processes that make it possible for manufacturers to continuously improve plant productivity, sustainability and safety.
Visitors to South Lower Hall, Booth 6107, can view highlights from the comprehensive Floor to Cloud portfolio, which includes AVENTICSTM, BransonTM, MoviconTM, PACEdge and PACSystemsTM solutions. Packaging automation experts will demonstrate how a Floor to Cloud approach unlocks trapped data and connects islands of automation, giving manufacturers the visibility and control to solve critical challenges and ambitious goals. Attendees will learn how to improve overall equipment effectiveness (OEE), increase energy efficiency while reducing waste, and create safer operations and digital record keeping.