Dow Packaging Innovation Awards returns for its 2023/2024 edition
Dow is back with the 2023/2024 edition of its Packaging Innovation Awards (PIA), the packaging industry’s premier accolade for recognizing breakthroughs in technological advancement, sustainability and enhanced user experience.
As one of the industry’s longest-running independently judged awards, the global program – now into its 35th edition – will be held in Asia-Pacific this year as the region plays host for the first time to both the judging event and awards ceremony. This marks a milestone for the awards as it continues its purpose of highlighting innovative packaging across industries and geographies.