Aluminum-free and mono-material blister packaging designs are being pursued by companies like TOPPAN and IWK Packaging Systems. Meanwhile, ACG is offering an alternative to co-extruded structures with its proprietary lamination-based approach.
IWK CABLIblue 870 Blister System features novel “card-to-card” technology where both the cardboard blister and its backing are made of the same material.
New infrastructure increases capacity by 20%, enhances efficiencies, shortens lead times and improves overall quality for prominent paperboard packaging provider.