Stäubli to present game-changing thermal management solutions at SEMI-THERM 29
Stäubli Connectors (www.staubli.com) will be at the 29th Annual SEMI-THERM Symposium and Exhibition, March 17 - 21 at the DoubleTree Hotel in San Jose, CA. Exhibiting in Booth 208, the industry pioneer will reveal connection solutions for thermal management that set new standards of durability, reliability and safety.
Visitors will quickly get a sense of the wide breadth of applications Stäubli addresses. An extensive line of standard and specialized couplings for thermal management and temperature control, from heavy duty full flow to dry break quick release couplings, demonstrates unparalleled expertise in cooling high-power, high-heat flux electronic components such as microprocessors, lasers, power electronics and many other components, devices and systems.
Suitable for every type of coolant, these robust couplings are noted for maintaining their integrity over thousands of connection cycles. They deliver high resistance to corrosion as well as compatibility with any type of coolant or system, thanks to durable construction and consistently high quality materials throughout, with particular attention paid to seals.
Stäubli connectors meet the needs of a wide range of industries including IT, energy, transportation, medical, defense, aerospace and more. They also adapt to a wide variety of work environments, which can be critical in challenging operating conditions, where safety is an issue. Non-spill, dry break design prevents fluids and gasses from leaking into electronic cabinets, work spaces and the environment during connection and disconnection, while a low pressure loss coefficient ensures minimal impact on cooling circuits. Plus, built-in blind mate couplings with connection guiding and misalignment compensation make the couplings a snap to use.
Stäubli's latest connection solutions will be on display in Booth 208 at SEMI-THERM, with experts on hand to answer questions and demonstrate product applications. The event is a must for discovering the latest technical developments in thermal management for electronic systems.