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Lee Smith is co-chair of OMAC’s Packaging Workgroup and a lead software engineer for Mettler Toledo. He is based in the U.K. and has led multiple international events focused on automation standardization and PackML.
OMAC and OPC Foundation jointly released a PackML OPC UA Companion Specification in 2018 — a nearly two-year effort to standardize how PackML information should be modeled in OPC UA. Since its release, technical solution providers have started to create real implementations of the specification.
Since becoming a standard 15 years ago, PackML has proven to be a powerful development and production tool. End users worldwide rely on PackML’s state model and consistent terminology to easily integrate disparate machines on a packaging line, manage production problems and simplify training.
