To help global food processors and manufacturers meet the documentation and active managerial control requirements of the Food Safety Modernization Act (FSMA), Mettler-Toledo Product Inspection has launched the enhanced ProdX 2.0 data management software system.
LOCK N’ POP™ introduces a new applicator that can monitor application amounts automatically for its water-based cohesive that forms a chemical bond with packaging surfaces and holds firm until it’s time to un-stack the pallets.
The global smart packaging market is expected to grow at 5.4% CAGR, hitting about US$52B by 2025. Market drivers include growing market for sustainable printed electronics, the Internet of Things and cloud computing, and rising food safety concerns.
In today’s changing packaging landscape, challenges and obstacles are sure to appear for packagers and suppliers meeting new industry standards, as well as satisfying consumer demand.
Products are being shipped all over the world. There is no place on the planet where any manufactured product cannot be shipped, but you need to ensure that the product reaches its destination in excellent condition.
Bosch Packaging Technology presents its latest development: the next generation Human Machine Interface HMI 4.0, suited for both stand-alone machines and entire lines.
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