MULTIVAC X-line: A New Dimension in Thermoforming
As a result of its seamless digitalization, comprehensive sensor system and networking with the MULTIVAC Cloud, the X-line from MULTIVAC (us.multivac.com/en) creates a new dimension, when it comes to packaging reliability, quality, performance and future-proofness. The machine manufacturer is showing the X-line at IPPE (International Production and Processing Expo) in Atlanta, Jan. 30-Feb.1, 2018.
MULTIVAC Pack Pilot enables the machine to be set up to the optimum level using machine control support. When new recipes are created, the machine parameterizes itself to the optimum operating point, using the die set data and the features for pack, product and packaging material that have been selected. This means that the machine can be used even without special operator knowledge. Pack Pilot has access to comprehensive expert knowledge, which benefits from process data from over 1,000 new packaging solutions per year. The X-line produces packs with maximum packaging reliability, consistent quality and very high output without production loss during machine start-up. This leads to significant savings as regards product, packaging materials and production time.
The X-line has a level of sensor control never achieved before, whereby the Multi Sensor Control captures all the relevant parts of the process. Using closed control circuits, the sensor system constantly captures a wide range of process values, such as for example for forming, evacuation and sealing. Even the forming and sealing dies are integrated into the sensor control via electronic sensor modules. All the process stages are coordinated to the optimum level, while product- and system-related discrepancies are automatically compensated as much as possible, and even faulty settings by operators are independently detected and displayed. Thanks to Multi Sensor Control, the X-line works constantly at the optimum operating point.
The intuitive HMI 3 Multi-Touch user interface is high-resolution and is equivalent to the operating logic of today's mobile devices. It enables the operating processes to be controlled even more easily and reliably, and it can be individually set to the particular operator. This includes different access rights and operating languages. User login is contactless by means of RFID chip cards. All the relevant machine parameters are displayed on one screen page.
A new die generation called X-tools guarantees the lowest operating costs in the market. The X-tools have an extensive range of innovations in their design, sensor system and actuating features. They enable shorter evacuation times to be achieved and therefore contribute to higher cycle outputs. As an option, the X-tools can be designed with a narrower edge trim width. This means that film trim is reduced by up to 30 percent. All the die elements are coded and can be identified by the thermoforming packaging machine. When a die is correctly installed, the machine parameterizes itself automatically, which ensures that there is optimum process control. This means that operating reliability is increased, particularly for machines with frequent format changes.