Items Tagged with 'Labelexpo'

BOBST has launched the FLEXJET module as a new option available for its DIGITAL MASTER 340 and 510 platforms, expanding application offering and boosting productivity for label converters.

 The move marks an exciting strategic step forward for the company, expanding its expertise in lamination and finishing into this high-growth sector.

Taking place at the Fira Gran Via in Barcelona from September 16 – 19, LabelExpo Europe is the world’s largest event for the label and package printing industry.

HERMA PP flex white (grade 840) and HERMA PP flex clear (grade 847) have a thickness of just 45 µm — around 40% less than standard PE films.

Visitors to the Flint Group/Xeikon booth, 6419 in Hall F, can meet the teams and learn about print technologies that minimize energy consumption, reduce waste, streamline operations and promote circularity.

XSYS showcased its wide range of solutions, which have been designed to reshape the future of label and packaging printing.

The single-step IML technology achieves a seamless part decoration right in the injection mold, where the label becomes an integral component of the packaging itself.

This marks the next stage of the Avery Dennison innovation journey, enabling the industry to drive to a more sustainable and connected future.

Visitors are cordially invited to experience thermoscript® thermal papers and jetscript® inkjet papers for label applications, as well as barricote® barrier papers for flexible packaging of food and non-food at booth 6A09. 

Company notes that Latin American demand for different printed products, including labels and packaging, especially highly embellished, sophisticated ones, has started to grow significantly.