Two packaging industry trends are causing headaches for automated case packing OEMs and their customers. OEMs must advance their design strategies to keep the cost of automation affordable so customers continue to receive optimum ROI.
Advances in all areas of automation technology continue to enable packaging operations to do more with less. New mechatronic solutions, which combine the principles of mechanical and electronic engineering for more flexible and adaptable machinery, take the next step.
OMAC and OPC Foundation jointly released a PackML OPC UA Companion Specification in 2018 — a nearly two-year effort to standardize how PackML information should be modeled in OPC UA. Since its release, technical solution providers have started to create real implementations of the specification.
Four OEMs share their experiences implementing PackML in machine design and build.
May 15, 2019
Many packaging machinery manufacturers find that implementing PackML across a machine product line isn’t as difficult as first thought and that the rewards exceed expectations. By implementing PackML, OEMs experience:
Flexible bags remain one of the most popular packaging formats in the snack industry due to their excellent barrier properties, cost-effective production and consumer convenience. High-speed vertical form, fill and seal (VFFS) technology offers significant advantages in this category because it enables manufacturers to maintain ambitious throughput targets and optimum productivity.
OMAC’s initiative to improve HMI usability and reduce operator training is moving to the next phase. As part of its efforts to develop a PackML HMI Implementation Guide, OMAC conducted a usability survey during PACK EXPO International last October. The evaluation challenged participants to complete a series of tasks on three different HMI designs.
Butler Automatic has named David Foskett as Sales Director. Foskett began his position in time to attend Pack Expo International in October, which was the perfect platform for introducing him to the company's customers and OEM partners.
Villa leads the organization within Schneider Electric that offers a comprehensive portfolio of hardware and software solutions and services for plant operators, original equipment manufacturers (OEMs) and machine users in manufacturing and other industrial environments.
In our October issue, the PACK EXPO Connects preview will whet your appetite for its new virtual format, applying IIoT technology and analytics, cold cereal trends, marketing as a tool for packaging, exploring tomorrow’s packaging and more.